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H-1B LCA Data

Principal Engineer, Firmware Engineering H-1B Visa Sponsors & Salaries

2 employers filed 66 certified H-1B LCAs for Principal Engineer, Firmware Engineering roles between FY2021 and FY2025. Median sponsored salary $142,667.

Active FY2021–FY20252 employers66 certified LCAs
Median salary
$142,667
typically $134,209–$152,839
Certified LCAs
66
FY2021–FY2025
Sponsors
2
employers filing this role
Salary range
$110,000+
up to $193,024

Top H-1B sponsors for Principal Engineer, Firmware Engineering

Top worksite cities for Principal Engineer, Firmware Engineering

LCA filings by fiscal year

Fiscal yearCertifiedDeniedTotal
FY202122022
FY20229010
FY202314014
FY202412012
FY2025909

Frequently asked questions

The median certified H-1B salary for Principal Engineer, Firmware Engineering roles is $142,667, typically $134,209 to $152,839.

Top sponsors by certified LCAs include Western Digital Technologies, Inc., Sandisk Technologies, Inc..
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